Future Customer Experience Mechanical/Thermal Engineer

Future Customer Experience Mechanical/Thermal Engineer

Description -

HP is the world’s leading computer systems and printing company, we create technology that makes life better for everyone, everywhere. Our innovation springs from a team of individuals, each collaborating and contributing their own perspectives, knowledge, and experience to advance the way the world works and lives.  We also create products and solution that help people connect and communicate more effectively regardless of locations and device.  We are looking for visionaries, like you, who are ready to make a purposeful impact on the way the world works.   At HP, the future is yours to create!

HP Poly organization, innovation is at the heart of everything we do. We believe that one thoughtful idea has the power to change the world.   The business unit, Future Customer Experiences team, is to deliver the future of hybrid work with new-to-the-world solutions. We commit to this charter and will be diligently partnering with our teammates on the NPD product and engineering teams to plan the right release vehicles to get our future innovations to market.

This role will support to design current and next generation innovative FCE hardware and solutions. 

This position is based in Fort Collins, Colorado, USA. 5 days a week in the office with flexibility to work from home as appropriate. The team is split between the USA and Taiwan.   

Travel is expected for this position and fluctuates throughout project cycles. It will be a mix between international and domestic, averaging 1-2 trips per quarter.

If you are our Future Customer Experience Mechanical Hardware engineer, you will conduct following activities on your job:

• Designs engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.
• Leads a project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for complex products.
• Designs and develops mechanical and electromechanical solutions to complex problems
•  Conducts structural and thermal analyses, including finite element analysis (FEA), computational fluid dynamics (CFD), and thermal modelling to optimize system performance
• Research, evaluates, and implements new materials and technologies for thermal management solutions
• Develops small to large (wearable to 70in display) consumer-product like mechanical designs
• Work cross-functionally with electrical, optical, compute, acoustic, and other teams with HP
• Works with suppliers and partners around the globe to ensure products meet HP requirements.
• Develops and implements test plan and criteria for new and existing designs, including validation of thermal performance, tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, system power measurements & acoustics.
• Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.
• Represents the mechanical/thermal team for all phases of larger and more-complex development projects.
• Provides guidance and mentoring to less- experienced staff members.
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and industry standards; provides tangible feedback to improve product quality
• Engagement with R&D technologists
• Routinely exercises independent judgment in developing criteria for achieving objectives

Are you a high-performer? We are looking for an individual with:

• 4+ years of professional engineering experience
• Using ProEngineer Creo, Solidworks or other 3D CAD software as a mechanical design tool.
• Strong analytical and problem solving skills.  Comfortable with highly analytical and technical approach to solving engineering problems. 
• Strong understanding and experience in electronics packaging and cooling.
• Experience designing components for prototypes and high volume production builds including:  3D printing, CNC machining, sheet metal, metal injection molding, plastic injection molding, casting, forging, etc…
• Strong understanding of heat transfer principles, including conduction, convection, and radiation
• Experience with thermal modeling software, such as ANSYS, COMSOL, Flotherm
• Experience using CFD and other thermal analysis tools to develop a product and design, build, and test prototypes to validate thermal solutions
• Experience achieving results through others - such as ODM partners and regional teams.
• Equal comfort with computer/desk work and testing/lab work.  
• Ability to effectively communicate product architectures, design proposals and negotiate options at management levels.
• Must have excellent English communication skills, verbal and written.
• Must be able to work well as part of a high-performance R&D team.
• Excellent interpersonal and teamwork skills in a large, diverse environment.
• Ability to work independently, with minimal supervision.
• Experience managing issues of technical and logistic complexity.
• Proven ability to manage time effectively and lead multiple projects simultaneously across businesses.
• Strong troubleshooting/debugging skills
• Possessing the following leadership qualities:
  • Integrity
  • Attention to detail
  • Sense of urgency
  • Goal oriented
  • Motivator
  • Able to implement creative solutions.
  • Delivers results

Education & Experience Recommended
• Four-year or Graduate Degree in Mechanical Engineering or any other related discipline or commensurate work experience or demonstrated competence.
• Typically has 4-7 years of work experience, preferably in engineering design and solutions, implementation across hardware development lifecycle, or a related field or an advanced degree with 3-5 years of work experience.

Preferred Certifications
NA

Knowledge & Skills
• 3D Modeling
• Ansys Simulation Software
• Computer-Aided Design
• Electromechanics
• Engineering Design Process
• Finite Element Methods
• Injection Molding
• Machining
• Manufacturing Processes
• Mechanical Design
• Mechanical Engineering
• Mechanical Systems
• New Product Development
• Product Design
• Product Lifecycle Management
• Prototyping and Testing
• PTC Creo (CAD Suite)

• Geometric Dimension and Tolerancing (GD&T)
• Sheet Metal
• SolidWorks (CAD)
• Thermal Management

Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity

Impact & Scope
• Impacts multiple teams and may act as a team or project leader providing direction to team activities and facilitates information validation and team decision making process.

Complexity
• Responds to moderately complex issues within established guidelines.

Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

​Job Posting Expiration Date: 12/01/2024

The base pay range for this role is $80,000 to $115,000 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only).  Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including; 
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

25%

Relocation -

Yes

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement