Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
TEM Engineers responsibilities include (but are not limited to):� Review incoming requests and determining appropriate TEM workflow strategy.� Hands on operation of laboratory equipment, such as TEM and FIB.� Monitoring and oversight of autonomous FIB sample preparation, ensuring maximum sample throughput.� Interpretation of complex TEM results, translating to actionable data for FAB process and integration teams.� Support continual development of new techniques.� Develop a thorough understanding of TEM operation lines.� Mentor junior TEM engineers and technicians. Candidate should have the following behavioral skills:� Demonstrated strength in teamwork, analytical problem solving, and effective oral and written communication skills.� Inquisitive, desire to learn and expand knowledge in field.� Ability to work with multi-functional, multi-cultural teams.� Strong in decision making and problem solving.
This position is associated with the sale of Intel's NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business' storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.
Minimum Qualifications:
� Master's degree in material science and engineering major.
� Greater than 2 years' experience in a TEM engineering laboratory.
Preferred Qualifications:
� Ph.D. in material science and engineering major.
� Greater than 5 years' experience operating a Transmission Electron Microscope and material characterization techniques.
� Experience with various types of TEM sample preparation.
� Strong TEM interpretation skillset
� Understanding of 3D NAND technology architecture
� Knowledge of wafer fabrication and general microelectronics.
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