NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 29,000 employees in more than 30 countries and posted revenue of $8.61 billion in 2020.

PRINCIPAL RF IC DESIGNER

Organization:

At NXP we impact day-to-day life for millions of people across the globe through our strategy of 'Secure Connections for a Smarter World'. NXP works side-by-side with customers to develop cutting-edge products and solutions for Mobile, the Connected Car, Cyber Security, Portable & Wearable and the Internet of Things. Interested in knowing what the future will look like? It's being created right here! We are passionate about winning in everything we do, we are especially passionate about delivering exceptional quality to our customers that goes beyond their expectations. This focus on exceptional quality combined with flawless execution and delivery is part of our DNA, it's who we are. NXP is committed to finding and developing the best talent; talent that is not afraid of taking absolute personal responsibility; talent that will lead us to even greater levels of success. With 45,000 people in 35 countries collaborating intensively at every level NXP Semiconductors (NASDAQ: NXPI) has a reputation for quality and excellence among engineers and customers alike. NXP continues to be the employer of choice for a growing number of industry-leading talent.

Smart Antenna Solutions, RF Integration without compromise

With 4B+ consumers coming online and over 50B connected devices, there is a massively growing demand for always-on connected devices. Consumers are also putting ever more pressure on wireless communications systems in terms of performance and reliability. For example we don’t want our mobile signal to drop out in the middle of a call, or struggle with a slow internet connection, or have to wait to find a GPS signal when travelling. Many of today’s devices are addressing these challenges by moving to Active Antenna Systems, with their ability to handle Multiple Input, Multiple Output (MIMO) requirements. However this adds even more complexity to the RF front-end, in addition to the ever shrinking available footprint. And many existing solutions lead to too much compromise when it comes to getting the right balance of performance, reliability, flexibility, integration ease and cost-of-ownership. NXP has long been a key innovator in RF process and product technologies. In comparison to other process technologies, our SiGe:C QUBiC technology provides the highest level of integration without compromise. It enables the entire RF front end to be integrated onto a single IC while still delivering exceptional RF performance and lowest total cost-of-ownership. In fact, as we see the further repartitioning of RF and media functions in mobile phones and other connectivity applications to address consumer demands, NXP will continue to help our customers achieve even more Integration Without Compromise.

Purpose of the job

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The RF IC Designer is part of a multifunctional team including RF IC architects, Design Engineers, Validation Engineers, Test-Product Engineers and Project leaders. The capabilities in the team enable innovation and product development of RF IC products from roadmap request up to full market release. The team is mainly working on IC products for Mobile Handset and Base Station equipment in the fields of Wireless LAN and 5G mmW transceiver applications. Position is based in City, Country. The projects are executed in close cooperation with other Product Creation Centers in France (EU) and the Netherlands (EU). The Principal Designer is responsible for the design work for a new product development. He/She likes to work in multicultural and highly complex environments and likes to innovate in product developments.

Your Responsibilities:

• Participate in the development of innovative RF and micro/mm-wave circuit designs, pushing the performance of the SiGe/CMOS transistors and passive devices to their limit to maximize the RF IC performance.

• Bring ideas for RF circuit design concepts, perform initial RF simulations to select optimal design concepts for given circuit block(s).

• Circuit design and design implementation to meet the block specification requirements.

• Give guidance to other design and layout engineers on block interaction to optimize overall system performance

• Responsible for design simulations to validate product performance using design kit models

• Participate in design reviews and reporting

Your Profile:

• At least 5 years experience in RF IC design, with significant experience in RF power amplifier (PA) design and/or LNA design.

• Experience in optimizing (passive) matching networks in combination with switches.

• Experience with relevant CAD tools (Cadence and ADS) and IC design methodology

• Knowledge of modelling thermal behavior of designs: die-package-PCB

• Experience with modelling metal RF structures and interconnect using EM tools: die -package - PCB

• Good understanding of semiconductor physics

• Structured IC design methodology covering specification, implementation, design and test

• Driven to achieve success and able to participate in a team of expert engineers to reach clear design goal.

• Able to drive technical decisions in a team based on facts and data in order to meet customer committed timelines.

• Fluent in English language both oral and written. Excellent communication skills, both verbal and in writing.

• Initiative and entrepreneurial attitude. Creative.

• Ability to travel globally