Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.
We are seeking product engineers to contribute to development and sustaining of NAND Flash memory products. Responsibilities span across following areas:� Responsible for product related quality and yield issues on NAND products.� Perform electrical failure analysis (EFA) to characterize and debug product issues, test inconsistencies and device marginalities.� Perform new test screen development and program release quality check in response of new fail modes to ensure baseline product quality� Optimize NAND trims, waveforms, and algorithms to improve product performance, reliability, and power consumption.� Co-work with fab QRE teams to perform product related risk assessment for major excursions and develop ad-hoc stresses/screens to enable appropriate material disposition.� Monitor unit level yield paretos and drive for improvement through process and test optimization.� Perform volume data mining for process commonality check for yield paretos and containment.� Support unit level data collection for fab critical process changes and provide risk assessment/impact from product point of view� Analyze, characterize and optimize the product test flow to balance quality and yield;� Work closely with SSD engineering teams to resolve NAND related issues observed during SSD MFG tests, qualification or in the field.
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